LTC4268-1
44
42681fc
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
BOTTOM VIEWEXPOSED PAD
R = 0.115
TYP
0.20 ?.05
1
16
17
32
6.00 REF
6.43 ?.10
2.65 ?.10
4.00 ?.10
0.75 ?.05
0.00 0.05
0.200 REF
7.00 ?.10
(DKD32) QFN 0707 REV A
0.40 BSC
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 ?45?CHAMFER
6.43 ?.05
2.65 ?.05
0.70 ?.05
0.40 BSC
6.00 REF
3.10 ?.05
4.50 ?.05
0.40 ?.10
0.20 ?.05
PACKAGE
OUTLINE
R = 0.05
TYP
DKD Package
32-Lead Plastic DFN (7mm ?/SPAN> 4mm)
(Reference LTC DWG # 05-08-1734 Rev A)
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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